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New Canon ‘200 mm wafer option’ for i-line and KrF semiconductor lithography equipment helps meet the growing demand for Internet-of-Things and automotive devices

TOKYO, December 11, 2017—Canon Inc. announced today that the Company has commenced sales of a "200 mm option" for the FPA-5550iZ2 i-line1 and the FPA-6300ES6a KrF2 semiconductor lithography equipment, released in December 2016 and April 2012, respectively. These two systems are renowned for their ability to mass-produce logic, memory and image sensor devices required for IoT and…
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HP Accelerates Path to Industrial 3D Manufacturing with New Jet Fusion 3D 4210 Printing Solution and Expanded Materials Portfolio

New high-volume 3D printing system and expansion of materials unlock 3D manufacturing’s economies of scale, raising “break-even point” to 110,000 and enabling industry’s lowest cost-per-part. News highlights: New HP 3D printing solution unlocks economies of scale for industrial 3D manufacturing, raising the “break-even point” of large-scale 3D production to up to 110K parts and enabling…
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