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New Canon ‘200 mm wafer option’ for i-line and KrF semiconductor lithography equipment helps meet the growing demand for Internet-of-Things and automotive devices

New Canon ‘200 mm wafer option’ for i-line and KrF semiconductor lithography equipment helps meet the growing demand for Internet-of-Things and automotive devices
TOKYO, December 11, 2017—Canon Inc. announced today that the Company has commenced sales of a "200 mm option" for the FPA-5550iZ2 i-line1 and the FPA-6300ES6a KrF2 semiconductor lithography equipment, released in December 2016 and April 2012, respectively. These two systems are renowned for their ability to mass-produce logic, memory and image sensor devices required for IoT and…
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HP Accelerates Path to Industrial 3D Manufacturing with New Jet Fusion 3D 4210 Printing Solution and Expanded Materials Portfolio

HP Accelerates Path to Industrial 3D Manufacturing with New Jet Fusion 3D 4210 Printing Solution and Expanded Materials Portfolio
New high-volume 3D printing system and expansion of materials unlock 3D manufacturing’s economies of scale, raising “break-even point” to 110,000 and enabling industry’s lowest cost-per-part. News highlights: New HP 3D printing solution unlocks economies of scale for industrial 3D manufacturing, raising the “break-even point” of large-scale 3D production to up to 110K parts and enabling…
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